Improved contact for thermal and electrical transport in carbon nanofiber interconnects

Authors

Tsutomu Saito
Toshishige Yamada, Santa Clara UniversityFollow
Drazen Fabris, Santa Clara UniversityFollow
Hirohiko Kitsuki
Patrick Wilhite, Santa Clara UniversityFollow
Makoto Suzuki
Cary Y. Yang, Santa Clara UniversityFollow

Document Type

Article

Publication Date

9-8-2008

Publisher

American Institute of Physics Publishing

Abstract

We study the performance and reliability of carbon nanofiber (CNF) interconnects under high-current stress by examining CNF breakdown for four test configurations, suspended/supported with/without tungsten deposition. The use of W is to improve the CNF-electrode contact. The supported cases show a larger current density just before breakdown than the suspended ones, suggesting an effective heat dissipation to the substrate. The W-deposited contacts reduce the initial total resistance from megaohm range without W to kilo-ohms. High-current stress does not change the total resistance of the test structures with W unlike those without W deposition.

Comments

Copyright © 2007 American Institute of Physics Publishing. Reprinted with permission.

Recommended Citation

T. Saito, T. Yamada, D. Fabris, H. Kitsuki, P. Wilhite, M. Suzuki, and C.Y. Yang, "Improved contact for thermal and electrical transport in carbon nanofiber interconnects," Applied Physics Letters 93, 102108 (3 pp) (2008). https://doi.org/10.1063/1.2979710