Title
Interface Analysis of Y-Ba-Cu-O Films on Al-Coated Si Substrates
Document Type
Article
Publication Date
3-27-1989
Publisher
American Institute of Physics Publishing
Abstract
Y‐Ba‐Cu‐O films were deposited on Al‐coated Si substrates by the plasma‐spray method. The Al buffer layer appears to be effective in yielding crack‐free adhesive Y‐Ba‐Cu‐O films. Resistance measurements indicate that the films exhibit a superconducting phase below 90 K. Results of x‐ray microanalysis and x‐ray photoelectron spectroscopy confirm that the Al buffer forms an Al2O3 layer and prevents precipitation of Cu at the film/substrate interface.
Recommended Citation
T. Asano, K. Tran, A.S. Byrne, M.M. Rahman, and C.Y. Yang, “Interface Analysis of Y-Ba-Cu-O Films on Al-Coated Si Substrates,” Applied Physics Letters 54, 1275-1277 (1989). https://doi.org/10.1063/1.101489
Comments
Copyright © 1989 American Institute of Physics Publishing. Reprinted with permission.