Contact resistance in carbon nanostructure via interconnects

Authors

Wen Wu
Shoba Krishnan
Toshishige Yamada, Santa Clara UniversityFollow
Xuhui Sun
Patrick Wilhite, Santa Clara UniversityFollow
Raymond Wu
Ke Li
Cary Y. Yang, Santa Clara UniversityFollow

Document Type

Article

Publication Date

4-20-2009

Publisher

American Institute of Physics Publishing

Abstract

We present an in-depth electrical characterization of contact resistance in carbon nanostructure via interconnects. Test structures designed and fabricated for via applications contain vertically aligned arrays of carbon nanofibers (CNFs) grown on a thin titanium film on silicon substrate and embedded in silicon dioxide. Current-voltage measurements are performed on single CNFs using atomic force microscope current-sensing technique. By analyzing the dependence of measured resistance on CNF diameter, we extract the CNF resistivity and the metal-CNF contact resistance.

Comments

Copyright © 2009 American Institute of Physics Publishing. Reprinted with permission.

Recommended Citation

W. Wu, S. Krishnan, T. Yamada, X. Sun, P. Wilhite, R. Wu, K. Li, and C.Y. Yang, “Contact resistance in carbon nanostructure via interconnects,” Applied Physics Letters 94, 163113 (3 pp) (2009). https://doi.org/10.1063/1.3123164