Electrothermal Analysis of Breakdown in Carbon Nanofiber Interconnects
Document Type
Article
Publication Date
5-2009
Publisher
IEEE
Abstract
To elucidate the observed current capacity behavior, a model is developed that takes into account heat transport through the entire carbon nanofiber interconnect test structure and breakdown location. The model also includes variations in contact location with the support material. The resulting predicted heat dissipation and current capacity are completely consistent with experimental data.
Recommended Citation
T. Yamada, T. Saito, D. Fabris, and C.Y. Yang, “Electrothermal Analysis of Breakdown in Carbon Nanofiber Interconnects,” IEEE Electron Device Letters 30, 469-471 (2009).
