Date of Award


Document Type



Santa Clara : Santa Clara University, 2020.


Mechanical Engineering

First Advisor

Panthea Sepehrband

Second Advisor

Calvin Tszeng


Ultrasonic Bonding is a solid-state bonding mechanism that can join two dissimilar materials. This report details work done to design, build, and analyze an ultrasonic ribbon bonder for research use at Santa Clara University. The bonder would allow researchers to view the bond site as the bond is being formed, which would be accomplished by bonding an aluminum ribbon to a silica substrate. Unfortunately, issues corresponding to COVID-19 led to difficulty in building the bonder during the final stages of construction. This led the team to focus on analysis rather than construction of the bonder. Specifically focusing on creating a plot of tool amplitude versus transverse force for different input powers, which showed a linear relationship between amplitude and force and also showed that input power has significantly more impact on amplitude than it does on force.