The Mission of the Department of Electrical Engineering is to educate our students, at the bachelor’s, master’s and doctoral levels, to prepare for careers in electrical engineering, or in other professions, in which they make a positive contribution to the growth of society, and to the betterment of the human condition, in the Jesuit tradition. We do this by teaching the concepts and the tools necessary to understand the physical world, particularly with respect to the fundamental laws of electricity and magnetism. Our students apply this knowledge to engineering problems, and they seek to understand the effect that electrical engineering has on society, and the obligations that the electrical engineer has to society. The Department contributes to the vitality of Silicon Valley and beyond through its teaching, practice, and scholarship.

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Submissions from 2018

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Conductive contact area estimation for carbon nanotube via interconnects using secondary-electron imaging, Yusuke Abe, Makoto Suzuki, Anshul Vyas, and Cary Y. Yang

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On-Chip Interconnect Conductor Materials for End-of-Roadmap Technology Nodes, Anshul A. Vyas, Changjian Zhou, and Cary Y. Yang

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Self-Driven Metal-Semiconductor-Metal Wse2 Photodetector with Asymmetric Contact Geometries, Changjian Zhou, Salahuddin Raju, Bin Li, Mansun Chan, Yang Chai, and Cary Y. Yang

Submissions from 2016

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Optimization of carbon nanotube ultracapacitor for cell design, Antonis Orphanou, Toshishige Yamada, and Cary Y. Yang

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Effect of Improved Contact on Reliability of Sub-60 nm Carbon Nanotube Vias, Anshul A. Vyas, Changjian Zhou, Yang Chai, Phillip Wang, and Cary Y. Yang

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Electrical properties of carbon nanotube via interconnects for 30 nm linewidth and beyond, Anshul A. Vyas, Changjian Zhou, Patrick Wilhite, Phillip Wang, and Cary Y. Yang

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Synthesis and interface characterization of CNTs on graphene, Changjian Zhou, Richard Senegor, Zachary Baron, Yihan Chen, Salahuddin Raju, Anshul A. Vyas, Mansun Chan, Yang Chai, and Cary Y. Yang

Submissions from 2015

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Diffraction model for thermoreflectance data, S. Kureshi, Drazen Fabris, Shawn Tokairin, Christopher V. Cardenas, and Cary Y. Yang

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Resistance Determination for Sub-100 nm Carbon Nanotube Vias, Changjian Zhou, Anshul A. Vyas, Patrick Wilhite, Phillip Wang, Mansun Chan, and Cary Y. Yang

Submissions from 2014

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Carbon Nanofiber Interconnect RF Characteristics Improvement with Deposited Tungsten Contacts, Anshul A. Vyas, Francisco Madriz, Nobuhiko Kanzaki, Patrick Wilhite, Xuhui Sun, Toshishige Yamada, and Cary Y. Yang

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Electron-beam and ion-beam-induced deposited tungsten contacts for carbon nanofiber interconnects, Patrick Wilhite, Hyung Soo Uh, Nobuhiko Kanzaki, Phillip Wang, Anshul A. Vyas, Shusaku Maeda, Toshishige Yamada, and Cary Y. Yang

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Metal–nanocarbon contacts, Patrick Wilhite, Anshul A. Vyas, Jason Tan, Jasper Tan, Toshishige Yamada, Phillip Wang, Jeongwon Park, and Cary Y. Yang

Submissions from 2013

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Temperature-Compensated High-Frequency Surface Acoustic Wave Device, Changjian Zhou, Yi Yang, Hualin Cai, Tian-Ling Ren, Mansun Chan, and Cary Y. Yang

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Surface acoustic wave resonators based on (002)AlN/Pt/diamond/silicon layered structure, Changjian Zhou, Yi Yang, Hao Jin, Bin Feng, Shurong Dong, Jikui Luo, Tian-Ling Ren, Mansun Chan, and Cary Y. Yang

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Visible-light photoresponse of AlN-based film bulk acoustic wave resonator, Changjian Zhou, Yi Yang, Y. Shu, Hualin Cai, Tian-Ling Ren, Mansun Chan, J. Zhou, Hao Jin, Shurong Dong, and Cary Y. Yang

Submissions from 2012

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Thermoreflectance Measurement of Temperature and Thermal Resistance of Thin Film Gold, Christopher Cardenas, Drazen Fabris, Shawn Tokairin, Francisco Madriz, and Cary Y. Yang

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Deposition of c-axis orientation aluminum nitride films on flexible polymer substrates by reactive direct-current magnetron sputtering, Hao Jin, J. Zhou, Shurong Dong, B. Feng, Jikui Luo, D. M. Wang, W. I. Milne, and Cary Y. Yang

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Modeling of a carbon nanotube ultracapacitor, Antonis Orphanou, Toshishige Yamada, and Cary Y. Yang

Submissions from 2011

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Application of Carbon Nanotubes to Thermal Interface Materials, Drazen Fabris, Michael Rosshirt, Christopher Cardenas, Patrick Wilhite, Toshishige Yamada, and Cary Y. Yang

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Breakdown voltage of ultrathin dielectric film subject to electrostatic discharge stress, Hao Jin, Shurong Dong, Meng Miao, Juin Jei Liou, and Cary Y. Yang

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E-beam-Deposited Tungsten Contacts for Carbon Nanofiber Interconnect Test Devices, N. Kanzaki, S. Maeda, Patrick Wilhite, Toshishige Yamada, Tsutomu Saito, and Cary Y. Yang

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Change in carbon nanofiber resistance from ambient to vacuum, Shusaku Maeda, Patrick Wilhite, Nobuhiko Kanzaki, Toshishige Yamada, and Cary Y. Yang

Submissions from 2010

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Extraction of contact resistance in carbon nanofiber via interconnects with varying lengths, Ken Li, Patrick Wilhite, Vinit Khera, Shoba Krishnan, Xuhui Sun, and Cary Y. Yang

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Frequency-Independent RC Circuit Model for One- Dimensional Carbon Nanostructures, Francisco R. Madriz, Toshishige Yamada, Xuhui Sun, Josh G. Nickel, and Cary Y. Yang

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Tunneling between carbon nanofiber and gold electrodes, Toshishige Yamada, Tsutomu Saito, Makoto Suzuki, Patrick Wilhite, Xuhui Sun, Navid Akhavantafti, Drazen Fabris, and Cary Y. Yang

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Temperature dependence of carbon nanofiber resistance, Toshishige Yamada, Hisashi Yabutani, Tsutomu Saito, and Cary Y. Yang

Submissions from 2009

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High efficient electrical stimulation of hippocampal slices with vertically aligned carbon nanofiber microbrush array, Edward D. de Asis Jr., T. D. Barbara Nguyen-Vu, Prabhu U. Arumugam, Hua Chen, Alan M. Cassell, Russell J. Andrews, Cary Y. Yang, and Jun Li

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Circuit Modeling of High-Frequency Electrical Conduction in Carbon Nanofibers, Francisco R. Madriz, John R. Jameson, Shoba Krishnan, Xuhui Sun, and Cary Y. Yang

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The effects of catalysts and underlayer metals on the properties of PECVD-grown carbon nanostructures, Xuhui Sun, Ken Li, Raymond Wu, Patrick Wilhite, Tsutomu Saito, Jing Gao, and Cary Y. Yang

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Contact resistance in carbon nanostructure via interconnects, Wen Wu, Shoba Krishnan, Toshishige Yamada, Xuhui Sun, Patrick Wilhite, Raymond Wu, Ke Li, and Cary Y. Yang

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Inductance in One-dimensional Nanostructures, Toshishige Yamada, Francisco R. Madriz, and Cary Y. Yang

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Electrothermal Analysis of Breakdown in Carbon Nanofiber Interconnects, Toshishige Yamada, Tsutomu Saito, Drazen Fabris, and Cary Y. Yang

Submissions from 2008

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Length dependence of current-induced breakdown in carbon nanofiber interconnects, Hirohiko Kitsuki, Toshishige Yamada, Drazen Fabris, John R. Jameson, Patrick Wilhite, Makoto Suzuki, and Cary Y. Yang

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Growth of Carbon Nanofibers on Nanoscale Catalyst Strips Fabricated with a Focused Ion Beam, Yusuke Ominami, Makoto Suzuki, Kiyotaka Asakura, and Cary Y. Yang

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Improved contact for thermal and electrical transport in carbon nanofiber interconnects, Tsutomu Saito, Toshishige Yamada, Drazen Fabris, Hirohiko Kitsuki, Patrick Wilhite, Makoto Suzuki, and Cary Y. Yang

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Secondary electron emission from freely supported nanowires, Makoto Suzuki, Kazuhiro Kumagai, Takashi Sekiguchi, Alan M. Cassell, Tsutomu Saito, and Cary Y. Yang

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Secondary electron imaging of embedded defects in carbon nanofiber via interconnects, Makoto Suzuki, Yusuke Ominami, Takashi Sekiguchi, and Cary Y. Yang

Submissions from 2007

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Palladium catalyzed formation of carbon nanofibers by plasma enhanced chemical vapor deposition, Quoc Ngo, Alan M. Cassell, Velimir Radmilovic, Jun Li, Shoba Krishnan, M. Meyyappan, and Cary Y. Yang

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Structural and Electrical Characterization of Carbon Nanofibers for Interconnect Via Applications, Quoc Ngo, Toshishige Yamada, Makoto Suzuki, Yusuke Ominami, Alan M. Cassell, Jun Li, M. Meyyappan, and Cary Y. Yang

Image Formation Mechanisms in Scanning Electron Microscopy of Carbon Nanofibers on Substrate, Makoto Suzuki, Hirohiko Kitsuki, Quoc Ngo, Toshishige Yamada, Kristofer Gleason, Yusuke Ominami, B. Roth, M. Betts, Alan M. Cassell, Jun Li, and Cary Y. Yang

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Bright-field transmission imaging of carbon nanofibers on bulk substrate using conventional scanning electron microscopy, Makoto Suzuki, Quoc Ngo, Hirohiko Kitsuki, Kristofer Gleason, Yusuke Ominami, and Cary Y. Yang

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Current-induced breakdown of carbon nanofibers, Makoto Suzuki, Yusuke Ominami, Quoc Ngo, Cary Y. Yang, Alan M. Cassell, and Jun Li

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Monte Carlo simulation of scanning electron microscopy bright contrast images of suspended carbon nanofibers, Makoto Suzuki, Toshishige Yamada, and Cary Y. Yang

Submissions from 2006

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Characteristics of Aligned Carbon Nanofibers for Interconnect Via Applications, Quoc Ngo, Alan M. Cassell, Alexander J. Austin, Jun Li, Shoba Krishnan, M. Meyyappan, and Cary Y. Yang

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Bottom-up sample preparation technique for interfacial characterization of vertically aligned carbon nanofibers, Yusuke Ominami, Quoc Ngo, Nobuhiko P. Kobayashi, Kevin Mcilwrath, Konrad Jarausch, Alan M. Cassell, Jun Li, and Cary Y. Yang

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Interface Characteristics of Vertically Aligned Carbon Nanofibers for Interconnect Applications, Yusuke Ominami, Quoc Ngo, Makoto Suzuki, Alexander J. Austin, Cary Y. Yang, Alan M. Cassell, and Jun Li

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Bright contrast imaging of carbon nanofiber-substrate interface, Makoto Suzuki, Hirohiko Kitsuki, Quoc Ngo, and Cary Y. Yang

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Loop-Based Inductance Extraction and Modeling for Multiconductor On-Chip Interconnects, S. Yu, D. M. Petranovic, Shoba Krishnan, Kwyro Lee, and Cary Y. Yang

Submissions from 2005

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Structural Characteristics of Carbon Nanofibers for On-chip Interconnect Applications, Yusuke Ominami, Quoc Ngo, Alexander J. Austin, Hans Yoong, Cary Y. Yang, Alan M. Cassell, Brett A. Cruden, Jun Li, and M. Meyyappan

Study of Metal-Carbon Nanofiber Interfaces for On-chip Interconnect Applications, Yusuke Ominami, Quoc Ngo, Hans Yoong, Alexander J. Austin, Alan M. Cassell, and Cary Y. Yang

Submissions from 2004

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Thermal Interface Properties of Cu-filled Vertically Aligned Carbon Nanofiber Arrays, Quoc Ngo, Brett A. Cruden, Alan M. Cassell, Gerard Sims, M. Meyyappan, Jun Li, and Cary Y. Yang

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Electron Transport through Metal-Multiwall Carbon Nanotube Interfaces, Quoc Ngo, D. M. Petranovic, Shoba Krishnan, Alan M. Cassell, Qi Ye, Jun Li, M. Meyyappan, and Cary Y. Yang

Submissions from 2003

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A Unified RLC Model for High-Speed On- Chip Interconnects, Sang-Pil Sim, Shoba Krishnan, D. M. Petranovic, N. D. Arora, Kwyro Lee, and Cary Y. Yang

Submissions from 2002

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Modeling Inversion-Layer Carrier Mobilities in All Regions of MOSFET Operation, K Remashan, N. A. Wong, K Chan, Sang-Pil Sim, and Cary Y. Yang

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High-Frequency On-Chip Inductance Model, Sang-Pil Sim, Kwyro Lee, and Cary Y. Yang

Submissions from 2001

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Spectroscopic ellipsometry and electrical studies of as-grown and rapid thermal oxidized Si1−x−yGexCy films, W. K. Choi, W. Feng, L. K. Bera, Cary Y. Yang, and J. Mi

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Optical characterization of as-prepared and rapid thermal oxidized partially strain compensated Si1−x−yGexCy films, W. Feng, W. K. Choi, L. K. Bera, M. Ji, and Cary Y. Yang

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MOFSET Modeling Gets Physical, M. Miura-Mattausch, H. J. Mattausch, N. D. Arora, and Cary Y. Yang

Submissions from 2000

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Electrical Properties of Rapid Thermal Oxides on Si1−x−yGexCy Films, L. K. Bera, W. K. Choi, W. Feng, Cary Y. Yang, and J. Mi

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Structural Characterization of Rapid Thermally Oxidized Silicon-Germanium-Carbon Alloy Films, W. K. Choi, L. K. Bera, J. H. Chen, W. Feng, K. L. Pey, Hans Yoong, J. Mi, Fan Zhang, and Cary Y. Yang

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Structural Characterization of Rapid Thermal Oxidized Si1−x−yGexCy Alloy Films Grown by Rapid Thermal Chemical Vapor Deposition, W. K. Choi, J. H. Chen, L. K. Bera, W. Feng, K. L. Pey, J. Mi, Cary Y. Yang, A. Ramam, S. J. Chua, J. S. Pan, A. T.S. Wee, and R Liu